CUI Thermal Pads feature electrical isolation, conductivity ratings from 1.0W/m*K to 6.0W/m*K, and a dielectric breakdown of 2500V. Designed with non-silicone or silicone elastomer, these naturally sticky pads from CUI help move heat effectively by being a conductive layer between Peltier devices, heat sinks, and other surfaces.
Features
Sized to match CUI single-stage and multi-stage Peltier module footprintsSilicone based or silicone free
Specifications
1.0W/m*K to 6.0W/m*K thermal conductivity2500V dielectric breakdown4.0, 5.0, 6.0, or 8.0 dielectric constant (1MHz)
