IXYS 1700V XPT™ (eXtreme-light Punch Through) IGBTs are designed for high-voltage, high-speed power conversion applications. Developed using the using the proprietary thin-wafer XPT™ technology, the IGBTs provide reduced thermal resistance, low tail current, low-energy loss, and high-speed switching capabilities.
Features
Thin wafer XPT™ technologyLow on-state voltages VCE (sat)Co-packed fast recovery diodesPositive temperature coefficient of VCE (sat)International standard size high-voltage packagesHigh efficiencyElimination of multiple series connected devicesIncreased reliability of power systemsHigh Voltage PackageHigh Blocking VoltageLow Saturation VoltageLow Gate Drive RequirementHigh Power Density
Applications
Switch-Mode and Resonant-Mode Power SuppliesHigh-voltage Power SuppliesHigh-voltage Test EquipmentUninterruptible Power Supplies (UPS)
