Laird Thermal Systems Tflex™ HD80000 Thermal Gap Filler is a High Deflection series gap filler that combines 6W/mK thermal conductivity with superior pressure vs. deflection characteristics. This combination of features allows minimal stress on components while also yielding low thermal resistance. Laird Tflex HD80000 material is extremely soft but also can be handled and applied manually without the need to add a fiberglass or other reinforcement layer, maintaining the superior thermal performance of the product.
Features
6W/mK thermal conductivityLow pressure vs. deflectionExcellent surface wetting for low contact resistanceNo fiberglass reinforcementMinimizes board and component stressEnvironmentally friendly solution that meets regulatory requirements, including RoHS and REACH
