LeaderTech TGF Thermal Gap Filler Pads are heat transfer media that conform to surface irregularities and adhere to a wide range of component shapes and sizes. LeaderTech TGF pads also adhere to recessed areas and protrusions. The pliable conformity of TGF pads is excellent for filling air gaps and minute variations. These thermal gap filler pads feature -60°C to 200°C continuous use temperature.
Features
Silicone compound material-60°C to +200°C continuous use temperature
